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СтандартыIEC

IEC 60249-2-12:1987/AMD3:1994 ed2.0

Заменен
Amendment 3 - Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards — 5 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 61249-4-1:2008 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability — 25 стр.

На этот документ ссылаются

IEC 61249-4-1:2008 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability — 25 стр.
BS 123600-003:2001
Действует
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections — 26 стр.
BS 123300-003:2001
Действует
System of quality assessment. Capability detail specification. Rigid multilayer printed boards — 42 стр.
BS 123700-003:2001
Действует
System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections — 26 стр.