Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad— 29 стр.
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad— 29 стр.
Modular order for the development of mechanical structures for electronic equipment practices. Sectional specification. Interface co-ordination dimensions for the 25 mm equipment practice. Detail specification. Dimensions for subracks, chassis, backplanes, front panels and plug-in units— 40 стр.
Mechanical structures for electronic equipment. Dimensions of mechanical structures of the 482,6 mm (19 in) series. Subracks and associated plug-in units— 26 стр.
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Transfer adhesive films for flexible printed boards— 18 стр.
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections— 38 стр.
Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections— 50 стр.
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections— 50 стр.
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections— 34 стр.
