Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability— 23 стр.
Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Transfer adhesive films for flexible printed boards— 18 стр.
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections— 34 стр.
