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СтандартыIEC

IEC 60286-3:1986 ed1.0

Заменен
Packing of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes — 10 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60286-3:1991 ed2.0
Заменен
Packaging of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes — 25 стр.

На этот документ ссылаются

BS EN 140402-801:2015
Действует
Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2 — 42 стр.
BS EN 140401:2009
Действует
Blank Detail Specification. Fixed low power film surface mount (SMD) resistors — 34 стр.
BS EN 61760-3:2010
Действует
Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering — 28 стр.
BS EN 61760-2:2007
Действует
Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide — 12 стр.
BS EN 61188-5-4:2007
Действует
Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Components with J leads on two sides — 18 стр.
BS EN 61188-5-2:2003
Действует
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components — 56 стр.
BS EN 60384-3-1:2006
Действует
Fixed capacitors for use in electronic equipment. Blank detail specification: surface mount fixed tantalum electrolytic capacitors with manganese dioxide solid electrolyte. Assessment level EZ — 18 стр.
BS EN 60393-6:2016
Действует
Potentiometers for use in electronic equipment. Sectional specification. Surface mount preset potentiometers — 34 стр.
BS EN 60115-8:2012
Действует
Fixed resistors for use in electronic equipment. Sectional specification. Fixed surface mount resistors — 46 стр.
BS ISO 21067-1:2016
Действует
Packaging. Vocabulary. General terms — 30 стр.
PD CLC/TR 62258-3:2007
Действует
Semiconductor die products. Recommendations for good practice in handling, packing and storage — 48 стр.
18/30363138 DC
Действует
BS EN IEC 61760-1. Surface mounting technology. Part 1. Standard method for the specification of surface mounting components (SMDs) — 42 стр.
BS EN 61760-1:2006
Действует
Surface mounting technology. Standard method for the specification of surface mounting components (SMDs) — 34 стр.
BS EN 140401-802:2007+A3:2017
Действует
Detail specification: Fixed low power film SMD resistors. Rectangular. Stability classes 1; 2 — 36 стр.
BS EN 140401-803:2007+A3:2017
Действует
Detail specification: Fixed low power film SMD resistors. Cylindrical. Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2 — 40 стр.
BS EN 140402:2015+A1:2016
Действует
Blank Detail Specification: Fixed low power wirewound surface mount (SMD) resistors — 36 стр.
BS EN 140401-804:2011+A1:2013
Действует
Detail Specification: Fixed low power film high stability SMD resistors. Rectangular. Stability classes 0,1; 0,25 — 44 стр.
BS EN 140401-801:2007+A1:2013
Действует
Detail specification: Fixed low power film SMD resistors. Rectangular. Stability classes 0,1; 0,25; 0,5; 1 — 38 стр.
BS EN 60115-8-1:2015
Действует
Fixed resistors for use in electronic equipment. Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G — 48 стр.
IEC 60286-3:1991 ed2.0
Заменен
Packaging of components for automatic handling - Part 3: Packaging of leadless components on continuous tapes — 25 стр.