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IEC 60749-20-1:2009 ed1.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 63 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60749-20-1:2019 ed2.0
Действует
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 82 стр.
IEC PAS 62168:2000 ed1.0
Заменен
Symbols and labels for moisture-sensitive devices — 6 стр.
IEC PAS 62169:2000 ed1.0
Заменен
Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices — 17 стр.

На этот документ ссылаются

BS EN 62435-5:2017
Действует
Electronic components. Long-term storage of electronic semiconductor devices. Die and wafer devices — 24 стр.
BS EN 62137-4:2014
Действует
Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices — 48 стр.
PD IEC/TS 62686-1:2015
Действует
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications. General requirements for high reliability integrated circuits and discrete semiconductors — 68 стр.
BS EN 61760-4:2015+A1:2018
Действует
Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices — 38 стр.
BS EN 61760-4:2015
Заменен
Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices — 36 стр.
18/30379487 DC
Действует
BS EN 62435-8. Long-term storage of electronic components. Part 8. Passive electronic devices — 18 стр.
18/30379483 DC
Действует
BS EN 62435-7. Long-term storage of electronic components. Part 7. Micro-electromechanical devices — 20 стр.
18/30367158 DC
Действует
BS EN 62435-3. Electronic components. Long-term storage of electronic semiconductor devices. Part 3. Data — 15 стр.
BS EN IEC 62435-4:2018
Действует
Electronic components. Long-term storage of electronic semiconductor devices. Storage — 26 стр.
BS EN IEC 62435-6:2018
Действует
Electronic components. Long-term storage of electronic semiconductor devices. Packaged or finished devices — 22 стр.
BS EN 60749-37:2008
Действует
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer — 22 стр.
OVE EN 61760-4:2016-04
Заменен
Surface mounting technology -- Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015) (english version)
IEC PAS 62168:2000 ed1.0
Заменен
Symbols and labels for moisture-sensitive devices — 6 стр.
IEC PAS 62169:2000 ed1.0
Заменен
Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices — 17 стр.
IEC 61207-3:2002 ed2.0
Заменен
Gas analyzers - Expression of performance - Part 3: Paramagnetic oxygen analyzers — 55 стр.