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IEC 60749-20:2002 ed1.0

Заменен
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat — 49 стр.
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом