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IEC 61188-5-1:2002 ed1.0

Заменен
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements — 141 стр.
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
ICS
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
31.180 Printed circuits and boards / Печатные схемы и платы