Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides— 37 стр.
Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description— 48 стр.
BS IEC 61188-6-4. Printed boards and printed board assemblies. Design and use. Part 6-4. Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design— 39 стр.
Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description— 48 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009) (english version)
