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IEC 61189-2-807:2021 ed1.0

Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA — 17 стр.
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
ICS
31.180 Printed circuits and boards / Печатные схемы и платы