IEC 61189-3-719:2016 ed1.0

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling — 22 стр.

Описание Изменения Ссылки Версии

IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

ICS

31.180 Printed circuits and boards / Печатные схемы и платы