Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 65 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013); German version EN 61191-1:2013— 51 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018— 49 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (english version)
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018) (english version)
