Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 105 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Cyanate ester non-woven aramid laminate of defined flammability, copper-clad— 20 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide non-woven aramid laminate of defined flammability, copper-clad— 20 стр.
Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability— 16 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies— 46 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures— 128 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys— 18 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies— 50 стр.
