Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 241 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 105 стр.
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 65 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 141 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies— 26 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015); German version EN 61189-5-2:2015— 44 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015— 45 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015— 25 стр.
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015— 44 стр.
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (IEC 62137:2004 + Corrigendum:2005); German version EN 62137:2004— 29 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013) (english version)
Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution (IEC 60664-3:2003 + A1:2010) (english version)
Insulation coordination for equipment within low-voltage systems -- Part 3: Use of coating, potting or moulding for protection against pollution ( IEC 60664-3:2016) (english version)
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 141 стр.
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 65 стр.
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)— 105 стр.
