IEC 61189-5-601:2021 ed1.0

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards — 80 стр.

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На этот документ ссылаются

ÖVE/ÖNORM EN 61189-5-3:2015-12

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015) (english version)

ÖVE/ÖNORM EN 61189-5-4:2015-12

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015) (english version)

ÖVE/ÖNORM EN 61189-5-2:2015-12

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015) (english version)