IEC 61189-5:2006 ed1.0

Отменен

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies — 122 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 61189-5-502:2021 ed1.0

Действует

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies — 45 стр.

На этот документ ссылаются

BS EN 61190-1-2:2014

Действует

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly — 26 стр.