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СтандартыIEC

IEC 61191-1:1998 ed1.0

Заменен
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 89 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 61191-1:2013 ed2.0
Заменен
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 96 стр.

На этот документ ссылаются

BS EN 61193-1:2002
Действует
Quality assessment systems. Registration and analysis of defects on printed board assemblies — 26 стр.
BS EN 61192-4:2003
Действует
Workmanship requirements for soldered electronic assemblies. Terminal assemblies — 34 стр.
BS EN 61192-3:2003
Действует
Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies — 50 стр.
BS EN 61192-2:2003
Действует
Workmanship requirements for soldered electronic assemblies. Surface-mount assemblies — 68 стр.
BS EN 61191-6:2010
Действует
Printed board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods — 40 стр.
BS EN 61190-1-1:2002
Действует
Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 26 стр.
BS EN 61188-5-8:2008
Действует
Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) — 34 стр.
BS EN 61188-5-5:2007
Действует
Printed boards and printed board assemblies. Design and use. Attachment (land/joint) considerations. Components with gull- wing leads on four sides — 46 стр.
BS EN 61188-5-4:2007
Действует
Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Components with J leads on two sides — 18 стр.
BS EN 61188-5-2:2003
Действует
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components — 56 стр.
BS EN 61188-5-1:2002
Действует
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Attachment (land/joint) considerations. Generic requirements — 74 стр.
BS CECC 200025:1998
Действует
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities — 42 стр.
PD IEC/TS 62647-1:2012
Действует
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Preparation for a lead-free control plan — 36 стр.
BS EN 50548:2011+A2:2014
Действует
Junction boxes for photovoltaic modules — 44 стр.
BS EN 61192-5:2007
Действует
Workmanship requirements for soldered electric assemblies. Rework, modification and repair of soldered electronic assemblies — 42 стр.
BS EN 61191-4:1999
Заменен
Printed board assemblies, Sectional specification. Requirements for terminal soldered assemblies — 20 стр.
IEC 61191-1:2013 ed2.0
Заменен
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 96 стр.