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IEC 61191-2:2013 ed2.0

Заменен
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies — 53 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 61191-2:2017 ed3.0
Действует
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies — 33 стр.
IEC 61196-1-206:2005 ed1.0
Заменен
Coaxial communication cables - Part 1-206: Environmental test methods - Climatic sequence — 13 стр.
IEC 61191-2:1998 ed1.0
Заменен
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies — 49 стр.

На этот документ ссылаются

DIN EN 60068-2-58:2005-03
Отменен
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2004 — 27 стр.
PD IEC/TR 62343-6-6:2011
Заменен
Dynamic modules. Failure mode effect analysis for optical units of dynamic modules — 30 стр.
IEC 61191-2:2017 ed3.0
Действует
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies — 33 стр.
BS EN 61193-1:2002
Действует
Quality assessment systems. Registration and analysis of defects on printed board assemblies — 26 стр.
BS EN 61192-3:2003
Действует
Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies — 50 стр.
BS EN 61192-2:2003
Действует
Workmanship requirements for soldered electronic assemblies. Surface-mount assemblies — 68 стр.
BS EN 61190-1-1:2002
Действует
Attachment materials for electronic assembly. Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 26 стр.
BS EN 61188-5-4:2007
Действует
Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Components with J leads on two sides — 18 стр.
BS EN 61188-5-2:2003
Действует
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components — 56 стр.
BS EN 61188-5-1:2002
Действует
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Attachment (land/joint) considerations. Generic requirements — 74 стр.
BS CECC 200025:1998
Действует
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities — 42 стр.
PD IEC/TR 62343-6-6:2017
Действует
Dynamic modules. Design guide. Failure mode effect analysis for optical units of dynamic modules — 32 стр.
BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
PD IEC/PAS 60127-8:2014
Действует
Miniature fuses. Fuse resistors with particular overcurrent protection — 28 стр.
BS EN IEC 60127-8:2018
Действует
Miniature fuses. Fuse resistors with particular overcurrent protection — 30 стр.
BS EN IEC 61191-1:2018
Действует
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 50 стр.
BS EN 61191-1:2013
Заменен
Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies — 50 стр.
BS EN 61192-1:2003
Действует
Workmanship requirements for soldered electronic assemblies. General — 78 стр.
OVE EN IEC 61191-1:2019-07
Действует
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018) (english version)
IEC 61191-2:1998 ed1.0
Заменен
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies — 49 стр.