Каталог стандартов

+7 (495) 223-46-76 +7 (812) 309-78-59
inform@normdocs.ru

IEC 61191-3:1998 ed1.0

Заменен
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies — 31 стр.
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
ICS
31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования