IEC 61192-1:2003 ed1.0

Отменен

Workmanship requirements for soldered electronic assemblies - Part 1: General — 147 стр.

На этот документ ссылаются

BS EN 62137-1-3:2009

Действует

Surface mounting technology. Environmental and endurance test methods for surface mount solder joint. Cyclic drop test — 26 стр.

BS EN 61193-1:2002

Действует

Quality assessment systems. Registration and analysis of defects on printed board assemblies — 26 стр.

BS EN 61192-4:2003

Действует

Workmanship requirements for soldered electronic assemblies. Terminal assemblies — 34 стр.

BS EN 61192-3:2003

Действует

Workmanship requirements for soldered electronic assemblies. Through-hole mount assemblies — 50 стр.

BS EN 61192-2:2003

Действует

Workmanship requirements for soldered electronic assemblies. Surface-mount assemblies — 68 стр.

BS EN 61188-5-1:2002

Действует

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Attachment (land/joint) considerations. Generic requirements — 74 стр.

BS ISO 16525-9:2014

Действует

Adhesives. Test methods for isotropic electrically conductive adhesives. Determination of high-speed signal-transmission characteristics — 54 стр.

BS EN 61192-5:2007

Действует

Workmanship requirements for soldered electric assemblies. Rework, modification and repair of soldered electronic assemblies — 42 стр.

ÖVE/ÖNORM EN 62137-1-3:2009-08

Действует

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008) (english version)