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IEC 61249-2-13:1999 ed1.0

Действует
Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad — 29 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60249-2-13:1987/AMD1:1993 ed1.0
Заменен
Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 5 стр.
IEC 60249-2-13:1987 ed1.0
Заменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 23 стр.

На этот документ ссылаются

ÖVE/ÖNORM EN 60664-3:2010-11
Заменен
Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution (IEC 60664-3:2003 + A1:2010) (english version)
ÖVE/ÖNORM EN 60598-1:2009-11
Заменен
Luminaires - Part 1: General requirements and tests (IEC 60598-1:2008, modified) (english version)
IEC 60249-2-13:1987/AMD1:1993 ed1.0
Заменен
Amendment 1 - Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 5 стр.
IEC 60249-2-13:1987 ed1.0
Заменен
Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade — 23 стр.