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IEC 61249-8-8:1997 ed1.0

Действует
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings — 19 стр.
Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
ICS
31.180 Printed circuits and boards / Печатные схемы и платы