BS EN 62239-1. Process management for avionics. Management plan. Part 1. Preparation and maintenance of an electronic components management plan— 86 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018— 49 стр.
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan (IEC 62239-1:2018); German version EN IEC 62239-1:2018— 92 стр.
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2013) (english version)
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013) (english version)