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IEC 61760-3:2010 ed1.0

Заменен
Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering — 45 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 61760-3:2021 ed2.0
Действует
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering — 57 стр.

На этот документ ссылаются

BS EN 60068-2-58:2015
Заменен
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 42 стр.
BS EN 60068-2-58:2015+A1:2018
Действует
Environmental testing. Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 46 стр.
IEC 61760-3:2021 ed2.0
Действует
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering — 57 стр.
IEC 61760-2:2007 ed2.0
Заменен
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide — 17 стр.