BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards— 34 стр.
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011) (english version)
