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IEC 62739-1:2013 ed1.0

Действует
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing — 36 стр.
IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
ICS
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули
31.240 Mechanical structures for electronic equipment / Механические конструкции электронного оборудования