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IEC 62769-4:2021 ed2.0

Заменен
Field Device Integration (FDI) - Part 4: FDI Packages — 165 стр.
IEC 62769-4:2021 is available as IEC 62769-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
ICS
35.100.05 Multilayer. Including International Standardized Profiles / Многоуровневые прикладные системы. Включая международные стандартизованные профили
25.040.40 Industrial process measurement and control / Измерение и контроль производственного процесса