IEC PAS 62137-3:2008 ed1.0

Заменен

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints — 41 стр.

Описание Изменения Ссылки Версии

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Заменен на

IEC 62137-3:2011 ed1.0

ICS

31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули