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IEC PAS 62191:2000 ed1.0

Заменен
Acoustic microscopy for nonhermetic encapsulated electronic components — 16 стр.
Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.
ICS
31.080.01 Semiconductor devices in general / Полупроводниковые приборы в целом