NEW!IEC TR 62240-1:2018 is available as IEC TR 62240-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC TR 62240-1:2018 is a technical report, which provides information when using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. The uprating solutions described herein are considered exceptions, when no reasonable alternatives are available; otherwise devices are utilized within the manufacturers’ specifications. This document describes the methods and processes for implementing this special case of thermal uprating. All of the elements of these methods and processes employ existing, commonly used best engineering practices. No new or unique engineering knowledge is needed to follow these processes, only a rigorous application of the overall approach. The terms “uprating” and “thermal uprating” are being used increasingly in avionics industry discussions and meetings, and clear definitions are included in the present IEC Technical Report. They were coined as shorthand references to a special case of methods commonly used in selecting electronic components for circuit design. This new edition cancels and replaces the first edition published in 2013 and includes a revised wording for subclause 4.1 (Introduction to selection provisions) and the associated flowchart.