The present document applies in telecommunication centres and similar installations to the bonding network of the
building, the bonding network of the equipment, and the interconnection between these two networks. It contributes to
the standardization of telecommunication and datacom equipment installation.
It also co-ordinates with the pre-conditions of the installation to achieve the following targets:
safety from electrical hazards;
reliable signal reference;
satisfactory Electromagnetic Compatibility (EMC) performance.
A defined bonding configuration down to the equipment level shall facilitate the installation, operation and maintenance
of telecommunication centres in telecommunication buildings or similar installations independent of the equipment
supplier.
The specification of telecommunication and datacom equipment and of the pre-conditions of installation are subject to
agreement of the parties (e.g. the supplier and the purchaser). Annex A can be used in the procedure to achieve
agreement.
The present document does not cover safety and EMC aspects of the equipment. Those aspects are covered by other
relevant standards.
The present document does not apply to the installation of telecommunication and datacom equipment in locations other
than telecommunication centres, e.g.:
smaller telecommunication equipment inside a subscriber s building;
subscriber line terminal equipment.
NOTE: Earthing and bonding of equipment installed in locations other than telecommunication building is
covered by EN 50310 [8].