Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007); German version EN 61190-1-3:2007— 39 стр.
Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012); German version EN ISO 9455-10:2012— 15 стр.
Soft soldering fluxes - Test methods - Part 10: Flux efficacy tests, solder spread method (ISO 9455-10:1998); German version EN ISO 9455-10:2000— 11 стр.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (english version)
