OVE EN 61189-3-719:2017-01

Действует

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (english version)

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60068-2-14:2009 ed6.0

Заменен

Environmental testing - Part 2-14: Tests - Test N: Change of temperature — 37 стр.

IEC 60068-2-58:2015 ed4.0

Действует

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 75 стр.

IEC 60194:2015 ed6.0

Заменен

Printed board design, manufacture and assembly - Terms and definitions — 524 стр.