OVE EN 61760-4:2016-04

Заменен

Surface mounting technology -- Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015) (english version)

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60068-1:2013 ed7.0

Действует

Environmental testing - Part 1: General and guidance — 62 стр.

IEC 60749-20-1:2009 ed1.0

Заменен

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat — 63 стр.

IEC 60749-20:2008 ed2.0

Заменен

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat — 53 стр.

IEC 61340-5-1:2016/COR1:2017 ed2.0

Заменен

Corrigendum 1 - Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements — 1 стр.

IEC 61340-5-1:2016 RLV ed2.0

Заменен

Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements — 63 стр.

IEC 61340-5-1:2016 ed2.0

Заменен

Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements — 40 стр.

IEC 61760-2:2007 ed2.0

Заменен

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide — 17 стр.