OVE EN IEC 60286-3:2019-10

Действует

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019) (english version)

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 60191-2:1966/AMD9:2003 ed1.0

Действует

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions — 11 стр.

ÖVE/ÖNORM EN 60286-3:2014-03

Заменен

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013) (english version)

На этот документ ссылаются

DIN EN 141101:1992-11

Отменен

Harmonized system of quality assessment for electronic components; detail specification: lead-screw actuated and rotary preset potentiometers; german version EN 141101:1992 — 21 стр.

DIN EN 140103:1996-06

Отменен

Blank detail specification: Fixed low power non-wirewound resistors - Assessment level: P; German version EN 140103:1996 — 14 стр.

ÖVE/ÖNORM EN 60286-3:2014-03

Заменен

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2013) (english version)

DIN EN 129100:1994-03

Отменен

Sectional specification: wirewound surface mounting inductors; German version EN 129100:1993 — 37 стр.

DIN EN 129000:1994-03

Отменен

Generic specification; fixed RF wound inductors; German version EN 129000:1993 — 27 стр.