This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated
circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch
land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is
informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.