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ÖVE/ÖNORM EN 60191-6-17:2011-10

Действует
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide für stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60191-6-16:2007 ed1.0
Действует
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA — 21 стр.
IEC 60191-6-5:2001 ed1.0
Действует
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) — 10 стр.
BS EN 60191-6-13:2016
Действует
Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) — 22 стр.
BS EN 60191-6-5:2001
Действует
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA) — 14 стр.