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ÖVE/ÖNORM EN 61189-11:2014-03

Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013) (english version)
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 60194:2015 ed6.0
Заменен
Printed board design, manufacture and assembly - Terms and definitions — 524 стр.
IEC 61189-3:1997/AMD1:1999 ed1.0
Заменен
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) — 65 стр.
IEC 61190-1-3:2007+AMD1:2010 CSV ed2.1
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 85 стр.
ISO 9453:2006
Заменен
Soft solder alloys -- Chemical compositions and forms — 18 стр.
ISO 11357-1:2016
Действует
Plastics -- Differential scanning calorimetry (DSC) -- Part 1: General principles — 40 стр.
BS EN 60194:2006
Действует
Printed board design, manufacture and assembly. Terms and definitions — 122 стр.
BS EN 61189-3-719:2016
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling — 18 стр.
BS EN 61190-1-3:2007
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 38 стр.
ÖNORM EN ISO 9453:2007-01
Заменен
Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)
ÖNORM EN ISO 11357-1:2010-03
Заменен
Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2009)