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ÖVE/ÖNORM EN 61189-5-3:2015-12

Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015) (english version)
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Ссылочные документы

IEC 61189-5-601:2021 ed1.0
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards — 80 стр.
IEC 61189-6:2006 ed1.0
Отменен
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies — 83 стр.
IEC 61190-1-2:2014 ed3.0
Действует
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 46 стр.
IEC 61190-1-3:2007+AMD1:2010 CSV ed2.1
Заменен
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 85 стр.
BS EN 61189-5-1:2016
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Guidance for printed board assemblies — 32 стр.
BS EN 61189-6:2006
Действует
Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies — 44 стр.
BS EN 61190-1-2:2014
Действует
Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly — 26 стр.
BS EN 61190-1-3:2007
Действует
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 38 стр.