This part of IEC 62047 specifies the test methods to measure the residual stresses of films
with thickness in the range of 0,01 µm to 10 µm in MEMS structures fabricated by wafer
curvature or cantilever beam deflection methods. The films should be deposited onto a
substrate of known mechanical properties of Young’s modulus and Poisson’s ratio. These
methods are used to determine the residual stresses within thin films deposited on substrate
[1]1.