Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014) (english version)
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages— 0 стр.
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)— 10 стр.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 85 стр.
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 41 стр.
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad— 45 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages— 14 стр.
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)— 14 стр.
Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications— 38 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 24 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad— 26 стр.
