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SAE AMS3731/10

Заменен
POTTING COMPOUND, EPOXY Bisphenol A-Type Unfilled, Room Temperature Cure, Semiflexible
This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.
Тематика
Polymers
Textiles
Materials properties
Fabrics
Chemicals