Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014— 24 стр.
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002— 22 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013); German version EN 62739-1:2013— 19 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (IEC 62739-2:2016); German version EN 62739-2:2016— 18 стр.
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (IEC 62739-3:2017); German version EN 62739-3:2017— 34 стр.
Flux cored solder wire - Specification and test methods - Part 2: Determination of flux content (ISO 12224-2:1997); German version EN ISO 12224-2:1999— 4 стр.
Solder wire, solid and flux cored - Specification and test methods - Part 1: Classification and performance requirements (ISO 12224-1:1997); German version EN ISO 12224-1:1998— 13 стр.
Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:2020); German version EN ISO 9454-2:2020— 16 стр.
Soft soldering fluxes; test methods; part 1: determination of non-volatile matter, gravimetric method (ISO 9455-1:1990); German version EN 29455-1:1993— 5 стр.
