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ASTM D5109-99(2004)

Заменен
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards — 8 стр.
Реферат

These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring boards. The properties that these test methods shall examine are as follows: dielectric breakdown voltage parallel to laminations; dimensional instability; dissipation factor; flammability rating; flatwise flexural strength at room and elevated temperatures; behavior during oven blister test; peel strength at room and elevated temperatures; permittivity; pin holes and scratches in copper surface; purity of copper; behavior upong solder float test; solvent resistance; surface and volume resistivity; thickness; warp or twist; and water absorption.

Область применения

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.3 The procedures appear in the following sections:

ICS
83.140.20 Laminated sheets / Слоистые листы
31.180 Printed circuits and boards / Печатные схемы и платы
Сборник ASTM
10.02 Electrical Insulation (II): D2519–latest / Электрическая изоляция (II): с D2518 и далее
Тематика
Electrical Insulating Materials