Значение и использование

This guide recommends the water quality required for the electronics and microelectronics industries. High-purity water is required to prevent contamination of products during manufacture, since contamination can lead to an unacceptable, low yield of electronic devices.

The range of water purity is defined in accordance with the manufacturing process. The types of ultra-pure water are defined with respect to device line width. In all cases, the water-quality recommendations apply at the point of distribution.

The limits on the impurities are related to current contamination specifications and to available analytical methods (either performed in a suitable clean laboratory or by on-line instrumentation). On-line and off-line methods are used in accordance with current industry practice. Concentration of the sample may be required to measure the impurities at the levels indicated in Table 1.

TABLE 1 Requirements for Water at the Point of Distribution in the Electronics and Semiconductor Industries^A

ParameterType E-1Type E-1.1Type E-1.2^BType E-1.3^BType E-2Type E-3Type E-4 Linewidth (microns)1.0–0.50.35–0.250.18–0.090.065–0.0325.0–1.0>5.0 Resistivity, 25°C (On-line)18.118.218.218.216.5120.5 TOC (μg/L) (on-line for <10 ppb)5211503001000 On-line dissolved oxygen (μg/L)2510310 On-Line Residue after evaporation (μg/L)10.50.1 On-line particles/L (micron range) >0.05 μm500^C 0.05–0.11000200N/A^C 0.1–0.21000350<100N/A 0.2–0.5500<100<10N/A 0.5-1.0200<50<5N/A 1.0<100<20<1N/A SEM particles/L (micron range) 0.1–0.21000700<250N/A 0.2–0.5500400<100N/A3000 0.5–110050<30N/A10 000 10<50<30<10N/A100 000 Bacteria in CFU/Volume 100 mL Sample531N/A1050100 1 L Sample101 10 L Sample 1 Silica – total (μg/L)5310.510501000 Silica – dissolved (μg/L)310.50.5 Anions and Ammonium by IC (μg/L) Ammonium0.10.100.050.050 Bromide0.10.050.020.050 Chloride0.10.050.020.0501101000 Fluoride0.10.050.030.050 Nitrate0.10.050.020.05015500 Nitrite0.10.050.020.050 Phosphate0.10.050.020.05015500 Sulfate0.10.050.020.05015500 Metals by ICP/MS (μg/L) Aluminum0.050.020.0050.001 Antimony0.001 Arsenic0.001 Barium0.050.020.0010.001 Boron^D0.30.10.050.050 Cadmium0.010 Calcium0.050.020.0020.001 Chromium0.050.020.0020.001 Copper0.050.020.0020.00112500 Iron0.050.020.0020.001 Lead0.050.020.0050.001 Lithium0.050.020.0030.001 Magnesium0.050.020.0020.001 Manganese0.050.020.0020.010 Nickel0.050.020.0020.00112500 Potassium0.050.020.0050.00125500 Sodium0.050.020.0050.001151000 Strontium0.050.020.001 Tin0.010 Titanium0.010 Vanadium0.010 Zinc0.050.020.0020.00115500 Temperature Stability (K)±1 Temperature Gradient (K/10 min)<0.1 Dissolved Nitrogen On-line (mg/L)8-18 Dissolved Nitrogen Stability (mg/L)±2

^A The user should be advised that analytical data often are instrument dependent and technique dependent. Thus, the numbers in Table 1 are only guidelines. This table will be revised whenever the semiconductor industry develops new linewidths, thereby keeping the guidelines current.

^B Values shown in Type E-1.3 are a result of aligning ITRS risk factors of known contaminates to the production processes found in current semiconductor processing for the linewidth of interest and may differ in a few cases to those found in Type E-1.2. Users who wish to use the higher numbers for Type E-1.2 water should feel free to do so.

All values are equal to or less than with the exception of Resistivity.

^C Particle metrology has not kept pace with the decreasing line-width of semiconductor manufacturing. Current line-widths require the ability to monitor 20-nm particles. However, existing Optical Particle Counters (OPCs) are only capable of detecting 50-nm particles with a counting efficiency of <5%, and a background count (noise level) of 500 particles per liter. Particle-counting statistics become important as count levels approach the noise level. Therefore, the OPC setup and performance must be optimized. Particle levels must consistently be within the noise level of any OPC (regardless of any specified level).

^D Boron is monitored only as an operational parameter for monitoring the ion-exchange beds.

Область применения

1.1 This guide provides recommendations for water quality related to electronics and semiconductor-industry manufacturing. Seven classifications of water are described, including water for line widths as low as 0.032 micron. In all cases, the recommendations are for water at the point of distribution (POD).

1.2 Water is used for washing and rinsing of semiconductor components during manufacture. Water is also used for cleaning and etching operations, making steam for oxidation of silicon surfaces, preparing photomasks, and depositing luminescent materials. Other applications are in the development and fabrication of solid-state devices, thin-film devices, communication lasers, light-emitting diodes, photo-detectors, printed circuits, memory devices, vacuum-tube devices, or electrolytic devices.

1.3 Users needing water qualities different from those described here should consult other water standards, such as Specification D1193 and Guide D5196.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.