5.1 Auger electron spectroscopy yields information concerning the chemical and physical state of a solid surface in the near surface region. Nondestructive depth profiling is limited to this near surface region. Techniques for measuring the crater depths and film thicknesses are given in (1).5

5.2 Ion sputtering is primarily used for depths of less than the order of 1 μm.

5.3 Angle lapping or mechanical cratering is primarily used for depths greater than the order of 1 μm.

5.4 The choice of depth profiling methods for investigating an interface depends on surface roughness, interface roughness, and film thickness (2).

5.5 The depth profile interface widths can be measured using a logistic function which is described in Practice E1636.

1.1 This guide covers procedures used for depth profiling in Auger electron spectroscopy.

1.2 Guidelines are given for depth profiling by the following:

Section

Ion Sputtering 

6

Angle Lapping and Cross-Sectioning 

7

Mechanical Cratering 

8

Mesh Replica Method

9

Nondestructive Depth Profiling 

10

1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety, health, and environmental practices and determine the applicability of regulatory limitations prior to use.

1.5 This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.