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СтандартыBSI

18/30380157 DC

Действует
BS IEC 61189-5-601. Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 5-601. General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards — 34 стр.
ОписаниеИзмененияСсылкиВерсии

Ссылочные документы

IEC 62137-1-1:2007 ed1.0
Действует
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test — 30 стр.
IEC 61189-5-3:2015 ed1.0
Действует
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies — 79 стр.
IEC 60068-2-78:2012 RLV ed2.0
Действует
Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state — 29 стр.
IEC 61249-2-7:2002 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad — 41 стр.
IEC 61190-1-2:2007 ed2.0
Заменен
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 37 стр.
IEC 60191-6-19:2010 ed1.0
Действует
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage — 25 стр.
IEC 60068-2-58:2015 ed4.0
Действует
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) — 75 стр.
IEC 60068-2-14:2009 ed6.0
Заменен
Environmental testing - Part 2-14: Tests - Test N: Change of temperature — 37 стр.
IEC 62137-4:2014 ed1.0
Действует
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices — 85 стр.
IEC 61188-5-8:2007 ed1.0
Действует
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) — 61 стр.
IEC 61190-1-2:2014 ed3.0
Действует
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 46 стр.
IEC 60191-6-5:2001 ed1.0
Действует
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) — 10 стр.
IEC 62137-3:2011 ed1.0
Действует
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints — 90 стр.
IEC 60191-6-2:2001/COR1:2002 ed1.0
Действует
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages — 0 стр.
IEC 61249-2-8:2003 ed1.0
Действует
Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad — 45 стр.
IEC 61190-1-3:2007/AMD1:2010 ed2.0
Заменен
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications — 17 стр.
IEC 60068-2-66:1994 ed1.0
Действует
Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) — 33 стр.
IEC 61190-1-1:2002 ed1.0
Действует
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly — 41 стр.
IEC 61760-1:2006 ed2.0
Заменен
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) — 60 стр.