Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 24 стр.
Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad— 41 стр.
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides— 57 стр.
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly— 35 стр.
Detail Specification. Fixed low power film resistors. Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads— 38 стр.
Detail Specification: Fixed low power film resistors. Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads— 38 стр.
Connectors for electronic equipment. Tests and measurements. Mechanical tests on contacts and terminations. Test 16f. Robustness of terminations— 8 стр.
Fixed resistors for use in electronic equipment. Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G— 48 стр.
Electric cables. Fluid-filled, paper- and PPL-insulated, metal-sheathed cables and accessories for alternating voltages up to and including 400 kV ($iU$dm = 420 kV). Requirements and test methods— 46 стр.
System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections— 34 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)
Components for low-voltage surge protective devices - Part 312: Selection and application principles for gas discharge tubes (IEC 61643-312:2013+ corrigendum Jul. 2013) (english version)
Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 3: Electric double-layer capacitors (IEC 61881-3:2012 + A1:2013) (english version)
