Каталог стандартов

+7 (495) 223-46-76 +7 (812) 309-78-59
inform@normdocs.ru

IEC 61190-1-2:2002 ed1.0

Заменен
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly — 35 стр.
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
ICS
31.190 Electronic. Including preassembled modules / Электронные компоненты в сборе. Включая предварительно собранные модули