IEC 61190-1-2:2002 ed1.0

Заменен

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly — 35 стр.

Описание Изменения Ссылки Версии

Ссылочные документы

IEC 61190-1-2:2007 ed2.0

Заменен

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly — 37 стр.

На этот документ ссылаются

BS EN 62025-2:2005

Действует

High frequency inductive components. Non-electrical characteristics and measuring methods. Test methods for non-electrical characteristics — 28 стр.

BS EN 61189-5:2006

Действует

Test methods for electrical materials, interconnection structures and assemblies. Test methods for printed board assemblies — 66 стр.

BS EN 60068-2-21:2006

Действует

Environmental testing. Tests. Test U: Robustness of terminations and integral mounting devices — 32 стр.