Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 53 стр.
Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)— 30 стр.
Connectors for electronic equipment. Tests and measurements. Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses— 14 стр.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010) (english version)
Connectors for electronic equipment - Tests and measurements - Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses (IEC 60512-16-21:2012) (english version)